IC assembly distributes electrical signals from silicon wafers to PCB through different types of interconnection methods while providing protection from environmental stresses. Since 2022, Solidlite offers a variety of IC packaging technologies that meet numerous end product requirements, including thin profile, small footprint, light weight, efficient thermal dissipation, and better electrical performance and reliability.
Solidlite offers a wide range of packaging designed to provide a range of packaging solutions to our customers. Available packages include inner leadframe-finger pad packages such as MEMS (Microelectromechanical Systems Package), DFN (Dual Flat No Lead Package) and QFN (Quad Flat No Lead Package) and substrate-based packages such as Stacked QFN , LGA (Land Grid Array Package), SIP (System－In－Package).
Solidlite works with our material and equipment suppliers and customers to focus significant resources on the development of advanced packaging technologies. Solidlite has built up comprehensive engineering capability and manufacturing platform to fulfill customers' diversified product lineup and applications.
| Package Thickness | Package Size | Lead Count |
|---|---|---|
|
0.38mm 0.75mm 0.85mm 0.93mm 1.00mm |
2mm * 2mm | 8L |
| 3mm * 3mm | 12L、16L、20L | |
| 4mm * 4mm | 16L、20L、24L、28L | |
| 5mm * 5mm | 16L、24L、28L、32L、40L |
Package thickness and size, single chip or multiple chips can be customized according to customer needs.
Package thickness and size, single chip or multiple chips can be customized according to customer needs.
All devices are based on customer design and requirements.
Reliability testing must be performed upon customer request and consultation.
If there are no special requirements, it shall comply with the conditions of Jedec Std MSL 3.
| Test Item | Test Method | Test Condition | Equipment | Remark |
|---|---|---|---|---|
| Temp. & Humidity Storage | JEDEC-STD-22 A101 |
Ta=85℃, 85%RH | Temp & Humid Chamber | ● |
| Pressure Cooker | JEDEC-STD-22 A102 |
121°C/100%R.H. 29.7 psia |
Pressure Cooker Chamber | ▲ |
| High Temperature Storage | JEDEC-STD-22 A103 |
Ta=150℃ | Oven | ● |
| Temperature Cycle | JEDEC-STD-22 A104 |
-65℃ ~25℃ ~150℃ ~25℃ 30min 5min 30min 5min |
Temperature Cycle Chamber | ▲ |
| Precondition Test | JEDEC-STD-22 A113 |
MSL 3 | Oven, Temp & Humid Chamber, IR Reflow Oven |
● |
| HAST | JEDEC-STD-22 A118 |
130°C/85%R.H. 33.3 psia |
Temp & Humid Chamber | ▲ |
▲: Outsourcing testing